Electronics TechnicianListed on: 11/21/2018 7:33:00 AMPST
Location: Mount Kisco, NY
Description: *Experience in advanced semiconductor packaging including underfill, surface mount technology, solder reflow, and chip placement. Responsibilities include operation and some maintenance of processing and metrology equipment. Job requires strong mechanical aptitude, project organization and working knowledge of Microsoft Office. Must have good interpersonal skills with ability to work with Engineers, Scientists, and Inventors. Excellent communication skills, bother written and verbal, are required. Excellent teamwork skills and the ability to produce “world-class” caliber results are required. 5-7 years experience preferred.
Requirements: *Job Duty 1 - Proficient with underfill application tools and techniques. *Job Duty 2 - Proficient with surface mount technology including solder application, pick and place and solder reflow. *Job Duty 3 - Experience with chip placement. *Job Duty 4 - Interact with customers and engineers. *3. Other Skills Desired, Years in each skill, where applicable: *Experience with metrology tools such as x-ray and C-SAM. *Operation of thermocompression bonding. L. J. Gonzer Associates is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, or protected Veteran status.